Abhinav Parakh

We leverage recent advances in 3D-printing technology to design and fabricate a micro-ion trap with a spatially distinct loading zone for more efficient loading of ions from effusive thermal ovens. The design reduces the Mathieu-$q$ parameter in the loading zone by increasing the ion-electrode separation $r_0$, thereby potentially facilitating more effective laser cooling of hot ions. This circumvents the temporary thermal instability that arises when the rf potential is reduced during ion loading, a common practice to enable efficient laser cooling of hot ions. Simulations predict that expanding $r_0$ maintains a high trapped ion fraction from a simulated thermal source across a wide range of Mathieu-$q$ parameters. We demonstrate the manufacturability of this design by 3D-printing the rf rails of a four-rod ion trap and discuss the limitations imposed by state-of-the-art additive manufacturing techniques. We briefly compare hot-ion capture in the three-dimensional design presented here with that in a representative planar trap, illustrating one instance in which the former may be better for loading. The article concludes with an outlook for how this design may be incorporated into a quantum-CCD architecture to enhance ion loading and reduce associated experimental overheads.

We introduce an ion trap platform based on a 3D-printed micro-junction array, designed to implement quantum charge-coupled device (QCCD) architectures for large-scale quantum information processing (QIP). The integration of three-dimensionally structured micro Radio-Frequency (RF) electrodes above a surface-electrode trap enables flexible control of electric field profiles across both linear and junction regions. Through simulations, we demonstrate that the linear region exhibits deeper and more harmonic ion confinement with reduced RF drive power compared to conventional planar traps. Crucially, we identify a junction geometry that maintains uniform ion confinement during transport while substantially reducing the pseudopotential barrier. This reduction facilitates low-heating, high-fidelity transport of single- and multi-species ion crystals. Our results establish a viable route toward fault-tolerant quantum computing by enabling modular and scalable QCCD systems based on the state-of-the-art 3D-printing technologies.