M. Mariantoni

Large-scale quantum computers with more than $10^5$ qubits will likely be built within the next decade. Trapped ions, semiconductor devices, and superconducting qubits among other physical implementations are still confined in the realm of medium-scale quantum integration ($\sim 100$ qubits); however, they show promise toward large-scale quantum integration. Building large-scale quantum processing units will require truly scalable control and measurement classical coprocessors as well as suitable wiring methods. In this blue paper, we introduce a fully vertical interconnect that will make it possible to address $\sim 10^5$ superconducting qubits fabricated on a single silicon or sapphire chip: Pin-chip bonding. This method permits signal transmission from DC to $\sim 10$ GHz, both at room temperature and at cryogenic temperatures down to $\sim 10$ mK. At temperatures below $\sim 1$ K, the on-chip wiring contact resistance is close to zero and all signal lines are in the superconducting state. High-density wiring is achieved by means of a fully vertical interconnect that interfaces the qubit array with a network of rectangular coaxial ribbon cables. Pin-chip bonding is fully compatible with classical high-density test board applications as well as with other qubit implementations.

Quantum computing architectures are on the verge of scalability, a key requirement for the implementation of a universal quantum computer. The next stage in this quest is the realization of quantum error correction codes, which will mitigate the impact of faulty quantum information on a quantum computer. Architectures with ten or more quantum bits (qubits) have been realized using trapped ions and superconducting circuits. While these implementations are potentially scalable, true scalability will require systems engineering to combine quantum and classical hardware. One technology demanding imminent efforts is the realization of a suitable wiring method for the control and measurement of a large number of qubits. In this work, we introduce an interconnect solution for solid-state qubits: The quantum socket. The quantum socket fully exploits the third dimension to connect classical electronics to qubits with higher density and better performance than two-dimensional methods based on wire bonding. The quantum socket is based on spring-mounted micro wires the three-dimensional wires that push directly on a micro-fabricated chip, making electrical contact. A small wire cross section (~1 mmm), nearly non-magnetic components, and functionality at low temperatures make the quantum socket ideal to operate solid-state qubits. The wires have a coaxial geometry and operate over a frequency range from DC to 8 GHz, with a contact resistance of ~150 mohm, an impedance mismatch of ~10 ohm, and minimal crosstalk. As a proof of principle, we fabricated and used a quantum socket to measure superconducting resonators at a temperature of ~10 mK.

We present a method for measuring the internal state of a superconducting qubit inside an on-chip microwave resonator. We show that one qubit state can be associated with the generation of an increasingly large cavity coherent field, while the other remains associated with the vacuum. By measuring the outgoing resonator field with conventional devices, an efficient single-shot QND-like qubit readout can be achieved, enabling a high-fidelity measurement in the spirit of the electron-shelving technique for trapped ions. We expect that the proposed ideas can be adapted to different superconducting qubit designs and contribute to the further improvement of qubit readout fidelity.