Winfried Karl Hensinger

Ablation Removal of Transport-Blocking Defects in Surface-Electrode Ion Traps

Toby Maddock, Parsa Rahimi, Matthew Aylett, Rares Barcan, Sebastian Weidt, Winfried Karl Hensinger

Abstract

We demonstrate in situ removal of a transport-blocking defect on a surface-electrode ion trap device using a Q-switched Nd:YAG 532 nm pulsed ablation laser. This approach eliminates the need to vent and rebake the vacuum system, providing a low-overhead defect-remediation technique well suited for ion-shuttling architectures where system modifications typically incur substantial downtime - particularly in shuttling focussed experiments operating at temperatures that necessitate bakes. Additionally, the hardware used is readily available in many ion trap laboratories, making this solution attractive to experiments operating in such regimes. Following ablation, we observe near-unity shuttling success rates across the previously obstructed region and measure micromotion levels that remain within acceptable limits. This technique enables rapid, reliable restoration of transport pathways without interruption to experimental operation.

Engineering of Microfabricated Ion Traps and Integration of Advanced On-Chip Features

Zak David Romaszko, Seokjun Hong, Martin Siegele, Reuben Kahan Puddy, Foni Raphaël Lebrun-Gallagher, Sebastian Weidt [1], Winfried Karl Hensinger [1]

Abstract

Trapped atomic ions are a proven and powerful tool for the fundamental research of quantum physics. They have emerged in recent years as one of the most promising candidates for several practical technologies including quantum computers, quantum simulators, atomic clocks, mass spectrometers and quantum sensors. Advanced fabrication techniques, taken from established and nascent disciplines, are being deployed to create novel, reliable devices with a view to large scale integration and commercial compatibility. This review will cover the fundamentals of ion trapping before proceeding with a discussion of the design of ion traps for the aforementioned applications. We will analyse current microfabrication techniques that are being utilised, as well as various considerations which motivate the choice of materials and processes. Finally, we discuss current efforts to include advanced, on-chip features into next generation ion traps.